| 摘要 |
The present invention provides a method for manufacturing a semiconductor light emitting device package which comprises the following steps: arranging a plurality of light emitting structures including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer on a support substrate; forming a mixture containing a wavelength converting material and a glass composition on the light emitting structures; forming a wavelength converting unit by sintering the mixture; removing the support substrate; and cutting the light emitting structures with an individual element unit. |
