| 摘要 |
The present invention relates to a fingerprint sensor module using an electrical measurement method. According to the present invention, fingerprint sensor chip, a transmitting electrode connecting electrode, and a signal electrode line from a fingerprint sensor are formed on an electronic circuit substrate; a transmitting electrode and a film-side transmitting electrode connecting electrode are formed on a cover film which is a film serving as a cover for the fingerprint sensor module; the cover film is attached, through an adhesion layer, to the electronic circuit substrate on which the fingerprint sensor is mounted, and the transmitting electrode connecting electrodes are mutually and electrically connected to the electrically conductive adhesion layer by using an electrically conductive adhesive; and as the cover for the fingerprint sensor module, a film is used on which the transmitting electrode and the transmitting electrode connecting electrode made of metal are formed. The purpose of the present invention is to maximize the sensitivity in a structure using the cover of the fingerprint sensor module. |
