VAPOR DEPOSITION APPARATUS AND VAPOR DEPOSITION METHOD USING THE SAME

摘要

Disclosed are a vapor deposition apparatus whose length can be reduced, and which can easily improve properties of a thin film formed thereby, and a vapor deposition method using the same. According to an embodiment of the present invention, the vapor deposition apparatus includes: a deposition unit having a plurality of nozzle parts serially arranged in a first direction and a plurality of exhaustion parts alternately arranged with the plurality of nozzle parts; a substrate mounting unit on which a substrate is mounted, and which reciprocally moves a plurality of times below the deposition unit along a straight line parallel to the first direction; and a control unit for controlling movement of the substrate mounting unit. The control unit controls the substrate mounting unit to vary a start point of the reciprocal movement of the substrate mounting unit for each reciprocal movement.