| 摘要 |
A method of manufacturing a substrate including a micro hole, includes: setting a scanning rate (µm/sec) of pulsed laser light to 1×10 3 to 4000×10 3 µm/sec, the scanning rate being defined as a relative speed of a focal point of the laser light relative to a substrate when the focal point moves, the laser light having a pulse duration less than 10 picoseconds; adjusting a repetition rate (Hz) of the laser light so that a pulse pitch (µm) represented by the following Formula (1) is 0.08 to 0.8 µm; irradiating the substrate with the laser light, scanning the inside of the substrate with the focal point into which the laser light is collected while shifting the focal point at a constant scanning rate so as to overlap the focal points, each of which is one pusle, thereby forming a modified region having a lowered resistance to etching, at a region through which the focal point passed or at an adjacent region thereof; and forming a micro hole in the substrate by removing the modified region by an etching treatment. pulse pitch ¼m = the scanning rate ¼m / sec of the laser light / the repetition rate Hz of the laser light |
