| 摘要 |
PROBLEM TO BE SOLVED: To provide a curing agent for an epoxy resin with a difference in ability to cure the epoxy resin at around 80°C and around 150°C, which can selectively perform a curing reaction of the epoxy resin at around 150°C.SOLUTION: The curing agent for an epoxy resin comprises an imidazole-based compound represented by general formula (1), wherein R1 to R3 are each independently H, 1-10C alkyl or phenyl; R is 1-10C alkyl or phenyl; n is an integer of 1-5; m is an integer of 1-4; and k is an integer of 0-4, provided that the sum of m and k is an integer of 1-5. |
