发明名称 導電性ペースト、及び電子部品、並びに電子部品の製造方法
摘要 A conductive paste includes a metal powder, a glass frit containing a Si component, and an organic vehicle. The metal powder has a flat shape with a ratio a/b of a maximum length a to a maximum thickness b of 2.5 or more, a molar content of SiO2 in the glass frit is 36 to 59 percent by mole, and a volume content of the glass frit is 6 to 11 percent by volume. In external electrodes of a multilayer ceramic capacitor using this conductive paste, the molar content of SiO2 in a glass phase is 38 to 60 percent by mole, and an occupation rate of the glass phase is 30% to 60% on the area ratio, and a maximum length c of the glass phase is 5 μm or less.
申请公布号 JP5939475(B2) 申请公布日期 2016.06.22
申请号 JP20140502058 申请日期 2013.01.11
申请人 株式会社村田製作所 发明人 喜住 哲也;永元 才規;西坂 康弘;岡部 洋子
分类号 H01G4/232;C03C8/18;H01B1/00;H01B1/22;H01G4/12;H01G4/252;H01G4/30;H01G13/00 主分类号 H01G4/232
代理机构 代理人
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