INTEGRATED CIRCUIT DIE ATTACH USING BACKSIDE HEAT SPREADER,申请号EP20060760290-传众专利搜索

发明名称	INTEGRATED CIRCUIT DIE ATTACH USING BACKSIDE HEAT SPREADER
摘要	According to one embodiment of the invention, a method of die attach includes providing a chip, forming a heat conductive metal layer outwardly from a backside of the chip, and coupling the chip to a substrate. The heat conductive metal layer has a thickness of at least 0.5 mils.
申请公布号	EP1889290(A4)	申请公布日期	2016.06.22
申请号	EP20060760290	申请日期	2006.05.23
申请人	TEXAS INSTRUMENTS INCORPORATED	发明人	LANGE, BERNHARD
分类号	H01L23/10;H01L23/00;H01L23/12;H01L23/28;H01L23/34;H01L23/36;H01L23/433;H01L23/495	主分类号	H01L23/10
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