| 摘要 |
PROBLEM TO BE SOLVED: To avoid occurrence of bonding defect by favorably bonding a high-heat transfer material and a high-hardness material when in use as a mold and the like.SOLUTION: In a high-hardness high-thermal conductivity composite metallic material 1, a Cu-Ni-Si-based copper alloy material 3 and a high-hardness metallic material 2 are interfacially bonded, and a diffusion layer 4 of Ni, Si is formed on the bonding interface. The high-hardness high-thermal conductivity composite metallic material 1 can be produced by heating the Cu-Ni-Si-based copper alloy material 3 and the high-hardness metallic material 2 interfacially bonded and diffusing Ni and Si of the Cu-Ni-Si-based copper alloy to the side of the high-hardness metallic material to form the diffusion layer of Ni, Si on the interface. The favorable bonding condition is obtained by interfacial bonding of the Cu-Ni-Si-based copper alloy material 3 and the high-hardness metallic material 2. The diffusion layer 4 of Ni, Si is formed on the interface, and the negative effect due to the difference between the linear expansion coefficients of the Cu-Ni-Si-based copper alloy material 3 and the high-hardness metallic material 2 is prevented. Thus, the favorable bonding condition is maintained. |
