COVER MATERIAL FOR HERMITIC SEALING AND PACKAGE FOR CONTAINING ELECTRONIC COMPONENT

摘要

This cover material for hermetic sealing is a cover material for hermetic sealing employed for a package for containing an electronic component. The cover material 1 for hermetic sealing is constituted of a clad material including a base material layer made of an Ni-Cr-Fe alloy containing Ni, Cr and Fe or an Ni-Cr-Co-Fe alloy containing Ni, Cr, Co and Fe, and a surface layer bonded to one surface of the base material layer on a side of an electronic component containing member and made of Ni or an Ni alloy.