EPOXY RESIN CONTAINING SILICONE-MODIFIED EPOXY RESIN AND POLYVALENT CARBOXYLIC ACID COMPOUND, AND CURED PRODUCT THEREOF

摘要

[Problem to be Solved] An object of the present invention is to provide a silicone-modified epoxy resin composition that offers a cured product excellent in low permeability to gas, mechanical strength, and heat resistance and transparency and further offers an optical semiconductor sealing material excellent in heat cycle resistance, and a cured epoxy resin product obtained by curing the composition. [Solution] The present invention provides an epoxy resin composition comprising the following components (A) to (C):
(A) a silicone-modified epoxy resin having a cyclic siloxane structure,
(B) a silicone-modified epoxy resin having a branched siloxane structure, and
(C) an epoxy resin curing agent containing a polyvalent carboxylic acid having a tricyclodecane structure and a carboxylic anhydride compound.