发明名称 |
COMPOSITE SUBSTRATE, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE |
摘要 |
A composite substrate 10 includes a semiconductor substrate 12 and an insulating support substrate 14 that are laminated together. The support substrate 14 includes first and second substrates 14a and 14b made of the same material and bonded together with a strength that allows the first and second substrates 14a and 14b to be separated from each other with a blade. The semiconductor substrate 12 is laminated on a surface of the first substrate 14a opposite a surface thereof bonded to the second substrate 14b. |
申请公布号 |
EP2960925(A4) |
申请公布日期 |
2016.06.22 |
申请号 |
EP20140754763 |
申请日期 |
2014.02.18 |
申请人 |
NGK INSULATORS, LTD. |
发明人 |
IDE, AKIYOSHI;TAKAGAKI, TATSURO;MIYAZAWA, SUGIO;HORI, YUJI;TAI, TOMOYOSHI;HATTORI, RYOSUKE |
分类号 |
H01L21/02;H01L21/683;H03H3/08;H03H9/145;H03H9/25 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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