CHIP ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

摘要

According to an aspect of the present invention, provided is a chip electronic component capable of reducing a problem of a crack or a mounting defect or the like which can occur when manufacturing a thin slim chip, and a method for effectively manufacturing the same. The chip electronic component comprises: a main body of a magnetic material having a surface step on at least one surface thereof; a coil pattern unit arranged inside the main body of the magnetic material; and a filling unit formed to reduce the surface step by filling a part of a relatively thin area in the main body of the magnetic material.