发明名称 多層配線基板
摘要 PROBLEM TO BE SOLVED: To provide a multilayer wiring board that reduces the amount of power consumption of mounted elements as compared to a multilayer wiring board that does not adopt this configuration.SOLUTION: A multilayer wiring board 2 comprises: a first power-supply layer 21 supplying a power source to a first element 3 outputting a signal; a second power-supply layer 22 provided in the same layer as the first power-supply layer 21 so as to be electrically insulated from the first power-supply layer 21, supplying a power source to a second element 4 receiving the signal outputted from the first element 3, and functioning as a return path of a return current Irof the signal outputted from the first element 3; and an auxiliary layer 23 provided in a conductive layer adjacent to the first and second power-supply layers 21 and 22 so that a part is overlapped with the first and second power-supply layer 21 and 22 via a dielectric layer 210, and causing the return current Irflowing through the second power-supply layer 22 to pass into the first power-supply layer 21 as a deviation current Id.
申请公布号 JP5939137(B2) 申请公布日期 2016.06.22
申请号 JP20120250514 申请日期 2012.11.14
申请人 富士ゼロックス株式会社 发明人 井口 大介
分类号 H05K3/46;H05K1/02 主分类号 H05K3/46
代理机构 代理人
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