| 发明名称 |
RESIN COMPOSITION, AND LAMINATE FOR PRINTED CIRCUIT BOARD COMPRISING SAME |
| 摘要 |
The present disclosure relates to a resin composition, which serves as an insulation layer of a laminate for a printed circuit board while exhibiting adhesiveness to a metal base layer, the resin composition including: a rubber-modified epoxy resin; an epoxy resin; an inorganic filler; and a curing agent. |
| 申请公布号 |
EP2918637(A4) |
申请公布日期 |
2016.06.22 |
| 申请号 |
EP20130852401 |
申请日期 |
2013.10.02 |
| 申请人 |
DOOSAN CORPORATION |
发明人 |
LEE, HANG SEOK;HAN, DUK SANG;JUNG, YOON HO;YANG, DONG BO |
| 分类号 |
C08L51/04;B32B15/092;C08G59/18;C08L63/00;H05K1/03 |
主分类号 |
C08L51/04 |
| 代理机构 |
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代理人 |
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