发明名称 半導体装置の作製方法
摘要 PROBLEM TO BE SOLVED: To manufacture a semiconductor device, employing an oxide semiconductor, in which electric characteristics are stabilized and reliability is improved.SOLUTION: A method of manufacturing a semiconductor device employing an oxide semiconductor includes forming an oxide semiconductor film and then introducing oxygen into the oxide semiconductor film (first oxygen introduction processing), and forming an island-shaped oxide semiconductor layer by etching the oxide semiconductor film after the first oxygen introduction processing, and introducing oxygen at least to a side end portion of the island-shaped oxide semiconductor layer (second oxygen introduction processing).
申请公布号 JP5939812(B2) 申请公布日期 2016.06.22
申请号 JP20120014566 申请日期 2012.01.26
申请人 株式会社半導体エネルギー研究所 发明人 肥塚 純一;佐藤 優一
分类号 H01L29/786;H01L21/336;H01L21/8242;H01L21/8247;H01L27/10;H01L27/105;H01L27/108;H01L27/115;H01L29/788;H01L29/792 主分类号 H01L29/786
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