METHOD OF MANUFACTURING CHIP-ON-BOARD AND SURFACE MOUNT DEVICE LED SUBSTRATE

摘要

A method of manufacturing Chip-On-Board LED substrate (100) and Surface Mount Device LED substrate (108) is provided, characterized in that, the Chip-On-Board LED substrate (100) and Surface Mount Device LED substrate (108) includes a fine-patterned thick film, the method includes the steps of forming a glass based dielectric layer (103, 111) on a metal plate (101, 109), firing the glass based dielectric layer (103,111), applying a metal based conductor (104, 113) over the dielectric layer (103,111), drying the metal based conductor layer (104,113), firing the glass and metal layers (103, 104, 111,113) producing a thick film and positioning LED die (105) into pockets between circuits for Chip-on-Board application and soldering packaged LED (114) onto the circuit, wherein the method allows for consolidation of thick film and bonding to substrate (100, 108).

主权项

1. A method of manufacturing Chip-On-Board LED substrate (100) or Surface Mount Device Packaged LED (108), characterized in that, the LED substrate includes a fine-patterned thick film,
the method includes the steps of: i. forming a glass based dielectric layer on a metal plate (103, 111); ii. firing the glass based dielectric layer (103,111); iii. applying a metal based conductor over the dielectric layer (104,113); iv. drying the metal based conductor layer (104,113); v. firing the glass and metal layers producing a thick film (104,113); and vi. positioning LED die (105) into pockets between circuits or packaged LED (114) onto the conductive circuit; wherein the method allows for consolidation of thick film and bonding to substrate (100, 108).