TEMPERATURE CONTROL SYSTEM FOR SEMICONDUCTOR MANUFACTURING SYSTEM

摘要

Provided is a temperature control system configured to mix a low temperature heating medium and a high temperature heating medium to supply the heating mediums at a temperature according to a process recipe to an electrostatic chuck (ESC) configured to maintain a temperature and support a wafer in a chamber in which a semiconductor wafer processing process is performed, and a heating medium obtained by mixing a heating medium cooled through a thermoelectric element and a heating medium heated through a heater to a desired target temperature according to a first ratio and a second ratio is provided to a load and recovered from the load, and the heating medium is distributed to the thermoelectric element and the heater according to the first ratio and the second ratio, which are ratios upon the mixing, optimizing power consumption for cooling or heating.

主权项

1. A temperature control system configured to cool and heat a heating medium recovered from an operating load of a semiconductor manufacturing system and supply the heating medium at a target temperature, the temperature control system for the semiconductor manufacturing system comprising:
a mixer configured to mix a low temperature heating medium and a high temperature heating medium and supply the mixed heating medium to the load; a first heating medium tank configured to store the low temperature heating medium; a thermoelectric element block configured to cool the heating medium and provide the heating medium to the first heating medium tank; a first 3-way switching valve configured to provide the cooled heating medium of the first heating medium tank to the mixer at a first ratio and bypass the remaining heating medium to be recovered into the first heating medium tank through the thermoelectric element block; a second heating medium tank configured to store the high temperature heating medium; a heater configured to heat the heating medium and provide the heating medium to the second heating medium tank; a second 3-way switching valve configured to provide the heated heating medium of the second heating medium tank to the mixer at a second ratio and bypass the remaining heating medium to be recovered to the second heating medium tank through the heater; and a third 3-way switching valve configured to provide the heating medium recovered from the load to thermoelectric element block at the first ratio and provide the heating medium to the heater at the second ratio.