发明名称 |
Method For Manufacturing Electrically Conductive Adhesive Film, Electrically Conductive Adhesive Film, And Method For Manufacturing Connector |
摘要 |
A step of scattering electrically conductive particles on a wiring board having wiring that is formed in accordance with an array pattern of the electrically conductive particles and prevented from being charged, and charging the electrically conductive particles; a step of aligning the charged electrically conductive particles in a predetermined array pattern corresponding to the wiring pattern by moving a squeegee on the wiring board; and a step of bonding a transfer film having an adhesive material layer formed thereon to the wiring board and transferring the electrically conductive particles aligned in a predetermined array pattern to the adhesive layer. |
申请公布号 |
US2016168428(A1) |
申请公布日期 |
2016.06.16 |
申请号 |
US201414904456 |
申请日期 |
2014.07.28 |
申请人 |
DEXERIALS CORPORATION |
发明人 |
SHINOHARA Seiichiro |
分类号 |
C09J9/02;H01R4/04;H05K3/30;C09J7/00 |
主分类号 |
C09J9/02 |
代理机构 |
|
代理人 |
|
主权项 |
1. A method for manufacturing an electrically conductive adhesive film, the method comprising:
a step of scattering electrically conductive particles on a wiring board having wiring that is formed in accordance with an array pattern of the electrically conductive particles and prevented from being charged and charging the electrically conductive particles; a step of aligning the charged electrically conductive particles in a predetermined array pattern corresponding to the wiring pattern by moving a squeegee on the wiring board; and a step of bonding a transfer film having an adhesive layer formed thereon to the wiring board and transferring the electrically conductive particles aligned in a predetermined array pattern to the adhesive layer. |
地址 |
Tokyo JP |