发明名称 Method For Manufacturing Electrically Conductive Adhesive Film, Electrically Conductive Adhesive Film, And Method For Manufacturing Connector
摘要 A step of scattering electrically conductive particles on a wiring board having wiring that is formed in accordance with an array pattern of the electrically conductive particles and prevented from being charged, and charging the electrically conductive particles; a step of aligning the charged electrically conductive particles in a predetermined array pattern corresponding to the wiring pattern by moving a squeegee on the wiring board; and a step of bonding a transfer film having an adhesive material layer formed thereon to the wiring board and transferring the electrically conductive particles aligned in a predetermined array pattern to the adhesive layer.
申请公布号 US2016168428(A1) 申请公布日期 2016.06.16
申请号 US201414904456 申请日期 2014.07.28
申请人 DEXERIALS CORPORATION 发明人 SHINOHARA Seiichiro
分类号 C09J9/02;H01R4/04;H05K3/30;C09J7/00 主分类号 C09J9/02
代理机构 代理人
主权项 1. A method for manufacturing an electrically conductive adhesive film, the method comprising: a step of scattering electrically conductive particles on a wiring board having wiring that is formed in accordance with an array pattern of the electrically conductive particles and prevented from being charged and charging the electrically conductive particles; a step of aligning the charged electrically conductive particles in a predetermined array pattern corresponding to the wiring pattern by moving a squeegee on the wiring board; and a step of bonding a transfer film having an adhesive layer formed thereon to the wiring board and transferring the electrically conductive particles aligned in a predetermined array pattern to the adhesive layer.
地址 Tokyo JP