| 发明名称 |
Kinematic Holding System For A Placement Head Of A Placement Apparatus |
| 摘要 |
A kinematic holding system for a placement head of a placement apparatus comprises a placement head alignment device which comprises at least one length-variable holding member arranged at a distance from a joint between a placement head support and the placement head. This holding member determines the pivoting position of the placement head relative to the placement head support. The length of the holding member is changeable during the placement operation depending on a deformation of the placement head guide device caused by the pressing force of the placement head against the substrate in such a way that an axis error (tilt) of the placement head caused by the deformation of the placement head guide device is compensated. |
| 申请公布号 |
US2016167237(A1) |
申请公布日期 |
2016.06.16 |
| 申请号 |
US201615051583 |
申请日期 |
2016.02.23 |
| 申请人 |
Besi Switzerland AG |
发明人 |
Kostner Hannes;Lackner Dietmar;Speer Florian;Widauer Martin |
| 分类号 |
B25J17/02;H05K13/00;H05K13/04 |
主分类号 |
B25J17/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. Kinematic holding system for a placement head of a placement apparatus for mounting electronic or optical components on a substrate, comprising
a placement head guide device which comprises a placement head support for holding the placement head, and a placement head alignment device for adjusting the alignment of the placement head relative to the placement head support, wherein: the placement head alignment device comprises a joint via which the placement head is supported in an inclination-adjustable way on the placement head support, the placement head alignment device comprises at least one solid joint element with at least one first solid joint arm which is rigidly connected to the placement head support, and at least one second solid joint which is rigidly connected to the placement head and elastically connected to the first solid joint arm by means of a solid joint, the second solid joint arm is elastically deformable in relation to the first solid joint arm depending on a deformation of the placement head guide device caused by a pressing force of the placement head against the substrate in such a way that an axis error of the placement head caused by the deformation of the placement head guide device is compensated. |
| 地址 |
Cham CH |
