| 发明名称 |
BONDED BODY AND POWER MODULE SUBSTRATE |
| 摘要 |
The bonded body of the present invention includes: a ceramic member made of ceramics; and a Cu member which is made of Cu or a Cu alloy and bonded to the ceramic member through a Cu—P—Sn-based brazing filler material and a Ti material, wherein a Cu—Sn layer, which is positioned close to the ceramic member and in which Sn forms a solid solution with Cu, and a Ti layer which is positioned between the Cu member and the Cu—Sn layer, are formed at a bonded interface between the ceramic member and the Cu member, a first intermetallic compound layer made of Cu and Ti is formed between the Cu member and the Ti layer, and a second intermetallic compound layer containing P is formed between the Cu—Sn layer and the Ti layer. |
| 申请公布号 |
US2016167170(A1) |
申请公布日期 |
2016.06.16 |
| 申请号 |
US201414909282 |
申请日期 |
2014.08.18 |
| 申请人 |
MITSUBISHI MATERIALS CORPORATION |
发明人 |
Terasaki Nobuyuki;Nagatomo Yoshiyuki |
| 分类号 |
B23K26/324;B23K26/32;B23K26/322;B23K26/00 |
主分类号 |
B23K26/324 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A bonded body comprising:
a ceramic member made of ceramics; and a Cu member which is made of Cu or a Cu alloy and bonded to the ceramic member through a Cu—P—Sn-based brazing filler material and a Ti material, wherein a Cu—Sn layer, which is positioned close to the ceramic member and in which Sn forms a solid solution with Cu, and a Ti layer which is positioned between the Cu member and the Cu—Sn layer, are formed at a bonded interface between the ceramic member and the Cu member, a first intermetallic compound layer made of Cu and Ti is formed between the Cu member and the Ti layer, and a second intermetallic compound layer containing P is formed between the Cu—Sn layer and the Ti layer. |
| 地址 |
Tokyo JP |
