发明名称 銀被覆銅合金粉末およびその製造方法
摘要 A silver-coated copper alloy powder, which has a low volume resistivity and excellent storage stability (reliability), is produced by coating a copper alloy powder, which has a chemical composition comprising 1 to 50 wt% of at least one of nickel and zinc and the balance being copper and unavoidable impurities (preferably a copper alloy powder wherein a particle diameter (D 50 diameter) corresponding to 50% of accumulation in cumulative distribution of the copper alloy powder, which is measured by a laser diffraction particle size analyzer, is 0.1 to 15 µm), with 7 to 50 wt% of a silver containing layer, preferably a layer of silver or an silver compound.
申请公布号 JP5934829(B2) 申请公布日期 2016.06.15
申请号 JP20150173427 申请日期 2015.09.03
申请人 DOWAエレクトロニクス株式会社 发明人 井上 健一;尾木 孝造;江原 厚志;檜山 優斗;山田 雄大;上山 俊彦
分类号 B22F1/00;B22F1/02;B22F9/00;C22C9/04 主分类号 B22F1/00
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