| 摘要 |
The present invention relates to a mask bonding apparatus capable of bonding a substrate and a mask by uniformly attaching the substrate and the mask. According to an aspect of the present invention, provided is the mask bonding apparatus for bonding a substrate and a mask, which comprises: a mask; a mask frame coupled to an end unit of the mask; and an air plate having air holes for spraying air distributed therein, spraying the air toward the substrate to lift the substrate, and bonding the substrate to the mask. |
