发明名称 LEDランプ
摘要 PROBLEM TO BE SOLVED: To provide an LED lamp capable of suppressing thermal influence following radiation of heat of LED on an electric circuit board contained in a body portion.SOLUTION: An LED lamp 1 is configured so that an LED substrate 16 mounting thereon LEDs 15 is provided on a base plate 13, a cylindrical body portion 2 is joined to a rear surface 13A of this base plate 13, a connector 3 is provided on a terminal end 2A of the body portion 2, an electric circuit board 8 on which electric circuit components for lighting the LEDs 15 are mounted is contained in the body portion 2, a plurality of radiation fins 25 are provided to extend toward the terminal end 2A from the rear surface 13A of the base plate 13 along an outer circumferential surface of the body portion 2, a terminal end 2A-side end portion of each radiation fin 25 is arranged distanced from the connector 3 toward the base plate 13, and the body portion 2 is formed by two-color molding or insert molding using a high heat conductive resin material for the base plate 13-side of the body portion 2 and an insulating resin material for the terminal end 2A-side of the body portion 2.
申请公布号 JP5935854(B2) 申请公布日期 2016.06.15
申请号 JP20140210703 申请日期 2014.10.15
申请人 岩崎電気株式会社 发明人 内田 浩二;木村 重明;川尻 兼史;山口 芙由
分类号 F21S2/00;F21V19/00;F21V23/00;F21V29/503;F21V29/74;F21V31/00 主分类号 F21S2/00
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