| 摘要 |
A wire bonding apparatus which locally heats an object to be bonded and comprises a capillary (40), pattern coils (34, 35) that are arranged around the capillary (40) so as not to be in contact with the capillary (40), and a high-frequency power supply (50) for feeding a predetermined high-frequency power to the pattern coils (34, 35). The capillary (40) is provided with: a base part (41); a metal layer (42) which is provided on the outer surface of the base part (41), and wherein heat is generated by electromagnetic induction by means of the predetermined high-frequency power applied to the pattern coils (34, 35); and a diamond layer (43) which covers the outer surface of the metal layer (42) and the front end of the base part (41) and transfers the heat generated in the metal layer to the object to be bonded. Consequently, capillary heating is efficiently carried out without lowering the bonding quality. |
