| 摘要 |
The present invention relates to an array of chip sockets defined by an organic matrix framework surrounding sockets penetrating the organic matrix framework and a manufacturing method thereof. The chip sockets are rectangular with planarized walls which meet at corners having radii of curvature, which is equal to or less than 100 microns, thereby facilitating a close fit of each socket to an intended chip size, and enabling compact chip packaging and miniaturization. |
