LIGHT EMITTING DIODE PACKAGE AND METHOD FOR THE SAME

摘要

Disclosed are a light emitting diode package and a manufacturing method thereof. The light emitting diode package includes: a semiconductor structure including a first type semiconductor layer, a second type semiconductor layer, an active layer positioned between the first type semiconductor layer and the second type semiconductor layer; an ohmic contact layer positioned on the second type semiconductor layer of the semiconductor structure; a first pad positioned on the ohmic contact layer; a first insulating layer partially covering the ohmic contact layer and the first pad, and including a first opening unit for opening the first pad; and a first connection wire for electrically connecting with the first pad through the first opening unit of the first insulating layer. The insulating layer includes a distributed bragg reflection (DBR) layer.