发明名称 CURABLE COMPOSITION
摘要 The present invention aims to provide a curable composition that is usable in fast curing adhesives and the like and has excellent curability and excellent initial adhesion. The aim is accomplished by use of a curable composition that contains a polyoxyalkylene polymer (a1) having a reactive silyl group (e.g., trimethoxysilyl group) equivalent of 0.15 mmol/g to 1.5 mmol/g and a polyoxyalkylene polymer (a2) having a reactive silyl group equivalent of 0.010 to 0.14 mmol/g. Preferably, the polymers (a1) and (a2) both have a backbone with at least one branch.
申请公布号 EP2894199(A4) 申请公布日期 2016.06.15
申请号 EP20130835448 申请日期 2013.09.06
申请人 KANEKA CORPORATION 发明人 MIYAFUJI, KIYOSHI
分类号 C08L71/02;C08G65/336;C08L101/00;C08L101/10;C09J171/02;C09K3/10 主分类号 C08L71/02
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