发明名称 FLOORING SYSTEM
摘要 Described herein are flooring systems comprising: a first floor panel and a second floor panel, each of the first and second floor panels comprising: a top surface, a bottom surface, and a plurality of peripheral edges extending between the top and bottom surfaces; and a coupling surface formed on one peripheral edge; the coupling surfaces of the first and second floor panels being disposed proximate to each other forming a joint; and a thermally activated solid adhesive interspersed between the coupling surfaces of the first and second floor panel. Methods of installing these systems are also described.
申请公布号 EP3031999(A2) 申请公布日期 2016.06.15
申请号 EP20150198108 申请日期 2015.12.04
申请人 ARMSTRONG WORLD INDUSTRIES, INC. 发明人 RAMACHANDRA,, SUNIL
分类号 E04F15/02;E04F15/10 主分类号 E04F15/02
代理机构 代理人
主权项
地址