| 摘要 |
One example discloses a system for wafer material removal, including: a wafer structures map, identifying a first device structure having a first location and a second device structure having a second location; an material removal controller, coupled to the structures map, and having an material removal beam power level output signal and an material removal beam on/off status output signal; wherein the material removal controller is configured to select a first material removal beam power level and a first material removal beam on/off status corresponding to the first location; and wherein the material removal controller is configured to select a second material removal beam power level and a second material removal beam on/off status corresponding to the second location. Another example discloses an article of manufacture comprises at least one non-transitory, tangible machine readable storage medium containing executable machine instructions for wafer material removal. |
