| 发明名称 |
LIGHTING EMITTING DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME |
| 摘要 |
Provided is a light emitting device package and a method of fabricating the same. The light emitting device package comprises a package body having a cavity, a seed layer on a surface of the package body, a conductive layer on the seed layer, a mirror layer on the conductive layer, and a light emitting device in the cavity. |
| 申请公布号 |
EP2191518(B1) |
申请公布日期 |
2016.06.15 |
| 申请号 |
EP20080793723 |
申请日期 |
2008.09.05 |
| 申请人 |
LG INNOTEK CO., LTD. |
发明人 |
CHO, BUM CHUL;KIM, GEUN HO;SON, SUNG JIN;PARK, JIN SOO |
| 分类号 |
H01L33/48;H01L33/00;H01L33/46;H01L33/62 |
主分类号 |
H01L33/48 |
| 代理机构 |
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代理人 |
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