| 摘要 |
The invention provides a photosensitive resin composition, a photosensitive element, a method of forming an anti-corrosion pattern and a method of manufacturing a PCB. The photosensitive resin composition comprises an adhesive polymer (A), a light polymerized compound (B)possessing an olefinic unsaturated bond and a photopolymerization initiator (C), and the component A comprises, by mass, 50%-80% of structure units (a1) come from (methyl) acrylic benzyl ester derivatives, 5%-40% of structure units (a2) come from styrene derivatives, 1%-20% of structure units (a3) come form alkyl (meth)acrylate, and 5%-30% of structure units (a4) come from (meth) acrylate. |
