发明名称 THERMAL MITIGATION ADAPTATION FOR A MOBILE ELECTRONIC DEVICE
摘要 The various embodiments provide methods and systems for adjusting the thermal mitigation system of a mobile electronic device when an add-on outer casing is attached. The mobile electronic device determine whether an add-on outer case is attached to the mobile electronic device and change a thermal mitigation parameter of a thermal mitigation process implemented on the mobile electronic device in response. The determination may be via a sensor or a user input. A changed thermal mitigation parameter may be stored in memory, or input by a user or in a communication from the add-on case. The changed thermal mitigation parameter may be determined based on a particular make, model or properties of the add-on case, and/or may be obtained from a database stored in the device or accessed via a network. Removal of the case may be detected and the thermal mitigation parameter returned to an initial value.
申请公布号 EP3030947(A1) 申请公布日期 2016.06.15
申请号 EP20140758204 申请日期 2014.08.08
申请人 QUALCOMM INCORPORATED 发明人 JAIN, ANKUR;VADAKKANMARUVEEDU, UNNIKRISHNAN;MITTER, VINAY
分类号 G06F1/20;H04M1/02 主分类号 G06F1/20
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