发明名称 |
THERMAL MITIGATION ADAPTATION FOR A MOBILE ELECTRONIC DEVICE |
摘要 |
The various embodiments provide methods and systems for adjusting the thermal mitigation system of a mobile electronic device when an add-on outer casing is attached. The mobile electronic device determine whether an add-on outer case is attached to the mobile electronic device and change a thermal mitigation parameter of a thermal mitigation process implemented on the mobile electronic device in response. The determination may be via a sensor or a user input. A changed thermal mitigation parameter may be stored in memory, or input by a user or in a communication from the add-on case. The changed thermal mitigation parameter may be determined based on a particular make, model or properties of the add-on case, and/or may be obtained from a database stored in the device or accessed via a network. Removal of the case may be detected and the thermal mitigation parameter returned to an initial value. |
申请公布号 |
EP3030947(A1) |
申请公布日期 |
2016.06.15 |
申请号 |
EP20140758204 |
申请日期 |
2014.08.08 |
申请人 |
QUALCOMM INCORPORATED |
发明人 |
JAIN, ANKUR;VADAKKANMARUVEEDU, UNNIKRISHNAN;MITTER, VINAY |
分类号 |
G06F1/20;H04M1/02 |
主分类号 |
G06F1/20 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|