| 摘要 |
A chip lifting apparatus for lifting a semiconductor chip according to the present invention comprises: a first base member which is linearly formed; a second base member which is disposed in a direction perpendicular to the first base member; a chip lifting member which is installed on the second base member to be slidable; and a chip contact member which is provided to come in contact with a semiconductor chip. According to the present invention, when a plurality of semiconductor chips are divisionally disposed on a dicing tape, a semiconductor chip which as a target of bonding is separated and lifted from the other chips, thereby transferring only the bonding target chip. |
