| 摘要 |
A spattering device comprising: a chamber; a spattering target; and a shield provided along the inner wall of the chamber, wherein the spattering target and a substrate are disposed in a spattering space inside the shield and a thin film is formed on the substrate. Spattering is performed on the substrate by using the spattering device, wherein a chamber and a substrate are arranged in offset positions, and an imaginary plane, which is a vertical plane running through the center of the spattering surface of the spattering target and also runs orthogonal to a perpendicular line that is a normal line running through the center of the surface. An area from the imaginary plane toward the substrate is considered a substrate region, and spattering is performed in such a way that the distance from the center of the spattering surface to the entire surface of a shield located in the substrate region is longer than an offset distance which is the minimum distance from the center of the spattering surface to the normal line running through the center of the surface to be spattered upon. Accordingly, the formation of a film caused by the accumulation of spattered particles on a shield may be effectively prevented, and defects caused by particles arising from peeling of the film may be reduced. |
