发明名称 |
RESIN COMPOSITION, THERMALLY CONDUCTIVE ADHESIVE, THERMALLY CONDUCTIVE ADHESIVE SHEET, AND LAMINATE |
摘要 |
PROBLEM TO BE SOLVED: To provide a highly functional resin composition having high thermal conductivity and adhesiveness, and to provide a thermally conductive adhesive and a thermally conductive adhesive sheet having thermal conductivity and adhesiveness.SOLUTION: The resin composition containing an epoxy resin (A), a curing agent (B), and alumina particles (C) is provided. The alumina particles (C) have a specific particle diameter, the total amount of the alumina particles (C) is 88-95 mass% in the solid content of the resin composition, and 20 mass% or more of the alumina particles (C) are surface-treated alumina particles whose surfaces have been subjected to a silane coupling treatment.SELECTED DRAWING: None |
申请公布号 |
JP2016104832(A) |
申请公布日期 |
2016.06.09 |
申请号 |
JP20140243099 |
申请日期 |
2014.12.01 |
申请人 |
DIC CORP |
发明人 |
OSHIO ATSUSHI;ITOTANI KAZUO;MAEKAWA FUMIHIKO;ITO DAISUKE |
分类号 |
C08L63/00;B32B27/18;B32B27/38;C08K5/17;C08K7/00;C08K9/06;C08L71/10;C09J7/00;C09J11/04;C09J11/06;C09J163/00 |
主分类号 |
C08L63/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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