| 发明名称 |
LIGHT INTERCONNECTION DEVICE USING PLASMONIC VIA |
| 摘要 |
A light interconnection device includes a metal-insulator-metal (MIM) waveguide including first and second metal layers and a dielectric layer provided between the first and second metal layers, and a plasmonic antenna including a slot penetrating through the second metal layer. |
| 申请公布号 |
US2016161671(A1) |
申请公布日期 |
2016.06.09 |
| 申请号 |
US201514859756 |
申请日期 |
2015.09.21 |
| 申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
PARK Yeonsang;ROH Younggeun;KIM Jineun;LEE Changwon |
| 分类号 |
G02B6/122;G02B6/125 |
主分类号 |
G02B6/122 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A light interconnection device comprising:
a first metal-insulator-metal (MIM) waveguide comprising first and second metal layers and a dielectric layer provided between the first and second metal layers; and a first plasmonic antenna comprising a first slot penetrating through the second metal layer. |
| 地址 |
Suwon-si KR |
