| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable resin composition for semiconductor packages which is good in moldability, including transfer moldability, and high in light and heat resistances.SOLUTION: A curable resin composition for semiconductor packages contains, as essential components, a polyhedral polysiloxane modified product (A) obtained by modifying a polyhedral polysiloxane-based compound (a) containing alkenyl and/or hydrosilyl groups with a compound (b) having a hydrosilyl group and/or an alkenyl group capable of undergoing a hydrosilylation reaction with the component (a). |
