发明名称 ELECTROCONDUCTIVE-FILM-FORMING COMPOSITION AND METHOD FOR PRODUCING ELECTROCONDUCTIVE FILM
摘要 The present invention provides an electroconductive-film-forming composition capable of forming an electroconductive film having excellent conductivity and few voids and a method for producing an electroconductive film using the same. The electroconductive-film-forming composition of the present invention contains copper particles having an average particle diameter of 1 nm to 10 µm, copper oxide particles having an average particle diameter of 1 nm to 500 nm, a reducing agent having a hydroxy group, a metal catalyst including metals other than copper, and a solvent, in which the content of the copper oxide particles is 50% by mass to 300% by mass with respect to the content of the copper particles, the content of the reducing agent is 100 mol% to 800 mol% with respect to the content of the copper oxide particles, and the content of the metal catalyst is 10% by mass or less with respect to the content of the copper oxide particles.
申请公布号 EP3029119(A1) 申请公布日期 2016.06.08
申请号 EP20140832874 申请日期 2014.06.12
申请人 FUJIFILM CORPORATION 发明人 TSUYAMA HIROAKI;WATANABE TORU;HAYATA YUUICHI
分类号 C09D201/00;C09D1/00;C09D5/24;C09D7/12;H01B1/00;H01B1/22;H01B13/00;H05K1/09;H05K3/12 主分类号 C09D201/00
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