发明名称 板状物の加工方法
摘要 PROBLEM TO BE SOLVED: To provide a method for processing a plate-like object capable of processing, even a thinly formed plate-like object, without causing troubles such as chipping and cracking.SOLUTION: A method for processing a plate-like object in which a plurality of intersecting division schedule lines are set comprises: a tape sticking step of sticking a tape to a surface of the plate-like object; a groove formation step of forming a groove in the tape corresponding to the division schedule lines after performing the tape sticking step; a grinding step of denting a region corresponding to the groove formed in the groove formation step in the groove by holding the tape side of the plate-like object by a chuck table and grinding a rear surface of the plate-like object to a prescribed thickness and thinning the plate-like object to a state in which it is thicker than other regions after performing the groove formation step; and a division step of forming a plurality of chips by dividing the plate-like object along the division schedule lines after performing the grinding step.
申请公布号 JP5930840(B2) 申请公布日期 2016.06.08
申请号 JP20120116409 申请日期 2012.05.22
申请人 株式会社ディスコ 发明人 栗村 茂也
分类号 H01L21/301 主分类号 H01L21/301
代理机构 代理人
主权项
地址