发明名称 積層セラミック電子部品の製造方法
摘要 A method for manufacturing a multilayer ceramic electronic component significantly reduces and prevents swelling or distortion when a conductive paste is applied to a green ceramic element body. A ceramic green sheet used in the method satisfies 180.56≦̸A/B wherein A is a polymerization degree of an organic binder contained in the ceramic green sheet, and B is a volume content of a plasticizer contained in the ceramic green sheet.
申请公布号 JP5929511(B2) 申请公布日期 2016.06.08
申请号 JP20120117712 申请日期 2012.05.23
申请人 株式会社村田製作所 发明人 佐藤 浩司;眞田 幸雄;西坂 康弘
分类号 H01G4/30;H01G4/12 主分类号 H01G4/30
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