发明名称 積層実装構造体
摘要 PROBLEM TO BE SOLVED: To connect another component to a laminated mounting structure simply and with high density.SOLUTION: A laminated mounting structure 2 comprises: a first substrate 21 and a second substrate which are arranged with principal surfaces being parallel to each other; an inter-substrate connection member for connecting the principal surface of the first substrate and an undersurface of the second substrate; and inter-component connection members 27 each having a support part 273 which is vertically arranged on a component connection electrode 213, for supporting a lateral face of a columnar parallel part 271 on one end side and the columnar parallel part 271 arranged on the principal surface of the first substrate such that a longer direction is arranged parallel with the principal surface of the first substrate and the other end side extends in a direction toward an end of the principal surface of the first substrate. The laminated mounting structure 2 further comprises a protection layer formed between the principal surface of the first substrate and the undersurface of the second substrate, in which an end face of each parallel part 271 is exposed from an end face of the protection layer, and a component 29 arranged such that a principal surface is arranged on an end face side of the exposed parallel part 271 so as to be orthogonal to the principal surface of the first substrate is connected to the end face.
申请公布号 JP5932085(B2) 申请公布日期 2016.06.08
申请号 JP20150056772 申请日期 2015.03.19
申请人 オリンパス株式会社 发明人 中村 幹夫;関戸 孝典
分类号 H05K1/14 主分类号 H05K1/14
代理机构 代理人
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