| 摘要 |
PROBLEM TO BE SOLVED: To provide a separation and transfer method of a semiconductor substrate and a separation and transfer device for a semiconductor substrate capable of easily separating a semiconductor substrate one by one from a semiconductor substrate group with a simple method.SOLUTION: In a separation and transfer method of a semiconductor substrate, a suction tool 4 absorbs one semiconductor substrate 2p on the uppermost part of a semiconductor substrate group 2 loaded by superposing a plurality of semiconductor substrates 2p, the absorbed one semiconductor substrate 2p is separated from the semiconductor substrate group 2 by moving the suction tool 4 while exciting the semiconductor substrate group 2 with a resonance frequency of the semiconductor substrate group 2 or a frequency in the vicinity thereof, and the separated one semiconductor substrate 2p is transferred to a carrier 8. |
