发明名称 ELECTRONIC COMPONENT MOUNTING DEVICE AND MOUNTING METHOD
摘要 An electronic component mounting device, including: a board conveyance device which conveys and positions a board on which an electronic component is mounted; a mounting device which positions and mounts the electronic component to a mounting position of the board; a loading device which picks up multiple engaged members (clips), and positions and loads the engaged members to a loading position of the board; and a placing device which picks up a cover component that covers the mounted electronic component and that is provided with an engaging portion at a predetermined position, and positions and places the cover component to a position such that the engaging portion corresponds to the engaged member.
申请公布号 EP3030067(A1) 申请公布日期 2016.06.08
申请号 EP20130890685 申请日期 2013.07.31
申请人 FUJI MACHINE MFG. CO., LTD. 发明人 HAYASHI, TETSUO;NAKANE, KUNIYASU;TESHIMA, CHIKASHI
分类号 H05K13/04;H05K3/30;H05K9/00 主分类号 H05K13/04
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