| 摘要 |
An electrical equipment accommodating housing which can be able to reduce the number of components and manufacturing processes. The electric-device housing with the housing having at least one bottom plate (11) and the side plates (12a, 12b, 12c, 12d), integrally formed in the bottom plate (11) on a IEC guide portion (50), the guide portion IEC (50) having a fitting guide portions (51b, 52b) is fitted in the groove of electrical equipment. In addition, the fitting guide portion (51b, 52b) of the thickness of the panel is greater than the thickness IEC guide specifications plate. Said fitting guide portion (51b, 52b) is formed as a wave structure. The profile height dimension (t), from the top of the peak to the bottom portion of the waveform is the same thickness as the IEC guide specifications plate. |
