发明名称 パワー半導体モジュール及びパワー半導体モジュールの駆動方法
摘要 Disclosed is a power semiconductor module which includes a unipolar type switching device using a wide bandgap semiconductor (wide bandgap semiconductor switching device) and an insulated gate bipolar transistor using a silicon semiconductor (Si-IGBT) connected in parallel, in which a chip area of the wide bandgap semiconductor switching device is smaller than that of the Si-IGBT.
申请公布号 JP5932269(B2) 申请公布日期 2016.06.08
申请号 JP20110195670 申请日期 2011.09.08
申请人 株式会社東芝 发明人 高尾 和人;四戸 孝
分类号 H02M1/08 主分类号 H02M1/08
代理机构 代理人
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