| 摘要 |
The present invention relates to a through board socket and a manufacturing method thereof. A side sealing plate is provided with openings at positions where a plurality of contacts insert and penetrate, the plurality of contacts insert the through openings, so that the side sealing plate and the plurality of contacts are formed integrally with an insulating shell covering at least a part of the openings, the plurality of contacts are insulated from the side sealing plate and are supported at the insulating shell. The plurality of contacts and the insulating shell are formed integrally, so that the plurality of contacts can be supported by the thin-walled insulating shell, at the same time, the plurality of the contacts are supported at the part of the insulating shell which is not overlapped with the wall thickness of the side sealing plate and covers the openings of the side sealing plate, therefore, the external diameter (D) of the contact inserting into the through board socket in a through direction is shortened, and an installing area is reduced. Provided are the through board socket which reduces the installing area for being installed to a printed circuit wiring substrate and is capable of performing high-density installation for the printed circuit wiring substrate, and a manufacturing method thereof. |
