发明名称 セラミック電子部品
摘要 Provided is a ceramic electronic component whereby reducing a proportion which conductive resin electrode layers occupy of external electrodes is possible, and economy is superior. A ceramic electronic component comprises a ceramic substrate (1), and external electrodes (5a, 5b) which are formed on the surface of the ceramic substrate. The external electrodes are configured to further comprise: metallic electrode layers (51a, 51b) which are formed upon the surface of the ceramic substrate and have a metal as a primary constituent thereof; insulating resin layers (52a, 52b) formed from an insulating resin, which are formed upon the metallic electrode layers such that primary portions of the metallic electrode layers, except the peripheral edge parts, are covered, and the peripheral edge parts are exposed; and conductive resin electrode layers (53a, 53b) formed from a resin including a conductive material, which are formed upon the insulating resin layers such that the insulating resin layers are covered, leading end parts reach to the peripheral edge parts of the metallic electrode layers which are not covered by the insulating resin layers, and contact is made with the metallic electrode layers.
申请公布号 JP5930045(B2) 申请公布日期 2016.06.08
申请号 JP20140529379 申请日期 2013.06.25
申请人 株式会社村田製作所 发明人 大沢 隆司
分类号 H01G4/232;H01G4/30 主分类号 H01G4/232
代理机构 代理人
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