发明名称 電子部品装着方法及び装着装置
摘要 The invention relates to an electronic part installing method and an installing device, which can conduct positioning on cover parts and install the cover parts behind a substrate and prevent dislocation before fixing through pressing and reduce tool variety. The electronic part installing device installs upper and lower moving components having pressing parts at a part transferring device and can drive the upper and lower moving components up and down. The pressing part is pressed and positioned at a cover part of regulated position. The electronic part installing method comprises a substrate moving and positioning process which is to move the substrate by a substrate moving device and to conduct positioning on the substrate; a cover part positioning and carrying process which is to select the cover part by means of a part transferring device through absorption and to conduct positioning and carrying on the cover parts to a regulated position of the positioned substrate in the substrate moving and positioning process; a pressing and assembling process which is to immediately drive the upper and lower moving components and press the cover parts by the pressing part after the cover parts are positioned and disposed at the regulated position by means of the part transferring device, and thereby an engaging mechanism of the cover part can be engaged with an engaged mechanism disposed at the substrate.
申请公布号 JP5930599(B2) 申请公布日期 2016.06.08
申请号 JP20110083631 申请日期 2011.04.05
申请人 富士機械製造株式会社 发明人 野田 明宏;久保田 知克;斉藤 達美;内藤 真治
分类号 H05K13/04;H05K13/08 主分类号 H05K13/04
代理机构 代理人
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