| 摘要 |
The present invention provides a chip electronic component which includes: a magnetic material main body comprising an insulating substrate, and a coil conductive pattern formed at least one surface of the insulating substrate; and an external electrode formed on both end units of the magnetic material main body to be connected to an end unit of the coil conductive pattern. The coil conductive pattern is formed by metal plating. In a cross section of the magnetic material main body in a longitudinal direction, a ratio of an outermost coil conductive pattern compared to an inner coil conductive pattern of the coil conductive pattern satisfies 1.0 to 1.5. |
