发明名称 プリント回路基板及びプリント回路基板におけるノイズ低減方法
摘要 Provided are: a circuit substrate with which an increase in the size of the area allocated to electromagnetic band gap structures formed from spiral open stubs can be inhibited, and mounting space can be utilized more effectively, even in cases when the frequency of the electromagnetic noise to be reduced is set so as to be further towards a low frequency side; and a noise reduction method for the circuit substrate. The circuit substrate of the invention of the present application is provided with: a core substrate; a reinforcing dielectric layer provided to one surface of the core substrate; first electromagnetic band gap structures which are provided to either of the surfaces of the reinforcing dielectric layer, and which suppress electromagnetic noise of a prescribed first frequency propagating in the core substrate; and auxiliary patterns which are formed around the outer peripheries of patterns forming the first electromagnetic band gap structures, with a prescribed distance therebetween.
申请公布号 JP5929969(B2) 申请公布日期 2016.06.08
申请号 JP20140121596 申请日期 2014.06.12
申请人 ヤマハ株式会社 发明人 川田 章弘
分类号 H05K3/46;H05K1/02;H05K1/16 主分类号 H05K3/46
代理机构 代理人
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